Electronic panel and display device including the same

ABSTRACT

An electronic panel including a base layer having a sensing area and a peripheral area adjacent to the sensing area, sensing electrodes overlapping the sensing area and disposed on the base layer, first lines overlapping the peripheral area and connected to one end and the other end of each of the sensing electrodes, an insulation layer including a first insulation portion configured to cover the sensing electrodes and disposed on the base layer and a second insulation portion configured to cover at least a portion of each of the first lines and disposed on the base layer, and second lines disposed on the second insulation portion and respectively electrically connected to the first lines through contact holes defined in the second insulation portion. The at least a portion of each of the first lines has a meandering shape.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a division of U.S. patent application Ser. No.16/951,930, which claims priority from and the benefit of Korean PatentApplication No. 10-2020-0014920, filed on Feb. 7, 2020, which are herebyincorporated by reference for all purposes as if fully set forth herein.

BACKGROUND Field

Embodiments of the present invention relate to a display device, andmore particularly, to an electronic panel through which an externalinput is enabled and a display device including the same.

Discussion of the Background

Various display devices used in multimedia equipment, such astelevisions, mobile phones, table computers, navigation devices, andgame consoles, are being developed. The display device may include anelectronic panel displaying an image and sensing an external input, apolarizing layer disposed on the display panel, and a window.

The electronic panel may include a display panel displaying an image andan input sensing layer sensing an external input. The input sensinglayer includes a plurality of sensing electrodes and a plurality ofsensing lines connected to the sensing electrodes. The sensing lines ofthe input sensing layer are electrically connected to an externalcircuit board.

The above information disclosed in this Background section is only forunderstanding of the background of the inventive concepts, and,therefore, it may contain information that does not constitute priorart.

SUMMARY

Embodiments of the inventive concept provide an electronic panel that iscapable of preventing sensing lines from being damaged by externalstatic electricity and a display device including the same.

Additional features of the inventive concepts will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the inventive concept.

An embodiment of the inventive concept provides an electronic panelincluding: a base layer including a sensing area and a peripheral areaadjacent to the sensing area; sensing electrodes overlapping the sensingarea and disposed on the base layer; first lines overlapping theperipheral area and connected to each of the sensing electrodes; aninsulation layer including a first insulation portion configured tocover the sensing electrodes and disposed on the base layer and a secondinsulation portion configured to cover at least a portion of each of thefirst lines and disposed on the base layer; and second lines disposed onthe second insulation portion and respectively electrically connected tothe first lines through contact holes defined in the second insulationportion, wherein the at least a portion of each of the first lines has ameandering shape.

The at least a portion of each of the first lines may include: a firstportion extending in a first direction; a second portion extending inthe first direction to face the first portion in a second directiondifferent from the first direction; and a third portion extending in thesecond direction to connect the first portion to the second portion.

The at least a portion of each of the first lines may have a curvedshape.

The first lines may include: first sub-lines, each of which is connectedto one end of each of the sensing electrodes; second sub-lines connectedto other ends of the sensing electrodes, respectively; and connectionlines respectively connected to the second lines through the contactholes and configured to connect the first sub-lines to the secondsub-lines, wherein each of the connection lines may have the meanderingshape.

The connection lines may be entirely covered by the second insulationportion.

One second sub-line of the second sub-lines may cross two or more secondlines of the second lines on a plane.

Each of the first sub-lines may have the meandering shape.

The first sub-lines may not overlap the insulation layer.

The first sub-lines, the second sub-lines, and the connection lines maybe disposed on the base layer through the same process.

The second lines may extend in a first direction and be spaced apredetermined distance from each other in a second direction differentfrom the first direction, and each of the second lines may have a planararea per unit length, which is greater than that of each of the firstlines.

Each of the second lines may include a first line portion bonded to anexternal circuit board and a second line portion that overlaps the atleast a portion of each of the first lines, and the at least the portionof each of the first lines may be disposed between the contact holes andthe first line portion in the first direction.

The contact holes may be disposed in the same line in the seconddirection.

The second lines may have the same length in the first direction.

At least two of the second lines may have different lengths in the firstdirection, and the contact holes overlapping the two second lines amongthe contact holes may be defined in different lines in the seconddirection.

The first insulation portion and the second insulation portion may bespaced apart from each other on a plane.

Each of the first lines may include a metal, and each of the secondlines may include an ITO electrode.

Another embodiment of the inventive concept provides a display deviceincluding: a display panel; and an input sensing layer disposed on thedisplay panel and including a sensing area and a peripheral areaadjacent to the sensing area, wherein the input sensing layer includes:a first insulation layer disposed on the display panel; first linesoverlapping the peripheral area and disposed on the first insulationlayer, the first lines including connection lines, first sub-lines, eachof which is adjacent to one end of each of the connection lines, andsecond sub-lines adjacent to the other ends of each of the connectionlines; a second insulation layer including a first insulation portionoverlapping the sensing area and a second insulation portion overlappingthe peripheral area and configured to cover a portion of each of theconnection lines; sensing electrodes overlapping the sensing area anddisposed on the first insulation portion, each sensing electrodeincluding one end connected to each of the first sub-lines and the otherend connected to each of the second sub-lines; and second lines disposedon the second insulation portion, the second lines being electricallyconnected to the connection lines through contact holes defined in thesecond insulation portion, respectively, wherein at least a portion ofeach of the connection lines has a meandering shape.

The display device may further include a circuit board configured toprovide a sensing signal to the input sensing layer, wherein each of thesecond lines may include a first line portion bonded to the circuitboard and a second line portion that overlaps the at least a portion ofeach of the first lines, and the at least a portion of each of theconnection lines may be disposed between the contact holes and the firstline portion.

The first sub-lines, the second sub-lines, and the connection lines maybe disposed on the first insulation layer through the same process, andeach of the second lines may have a planar area per unit length, whichis greater than that of each of the first lines

One second line of the second lines may cross at least one or more firstlines of the first lines on a plane.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the inventive concept, and are incorporated in andconstitute a part of this specification. The drawings illustrateexemplary embodiments of the inventive concept and, together with thedescription, serve to explain principles of the inventive concept.

FIG. 1 is a perspective view of a display device according to anembodiment of the inventive concept.

FIG. 2 is an exploded perspective view of the display device accordingto an embodiment of the inventive concept.

FIG. 3 is a cross-sectional view of an electronic panel according to anembodiment of the inventive concept.

FIG. 4 is a cross-sectional view of an input sensing layer according toan embodiment of the inventive concept.

FIG. 5 is a plan view of the input sensing layer according to anembodiment of the inventive concept.

FIG. 6 is a plan view of a sensing insulation layer provided in theinput sensing layer according to an embodiment of the inventive concept.

FIG. 7 is an enlarged view of an area AA of FIG. 5 according to anembodiment of the inventive concept.

FIG. 8A is a cross-sectional view taken along line I-I′ of FIG. 7 .

FIG. 8B is a cross-sectional view taken along line II-II′ of FIG. 7 .

FIG. 9 is an enlarged view of an area IDA of FIG. 5 according to anembodiment of the inventive concept.

FIGS. 10A and 10B are plan views illustrating different shapes for oneconnection line of connection lines of FIG. 9 according to an embodimentof the inventive concept.

FIG. 11 is a cross-sectional view taken along line III-III′ of FIG. 9according to an embodiment of the inventive concept.

FIG. 12 is a cross-sectional view taken along line IV-IV′ of FIG. 9according to an embodiment of the inventive concept.

FIG. 13 is an enlarged view of an area IDA of FIG. 5 according toanother embodiment of the inventive concept.

FIG. 14 is an enlarged view of an area IDA of FIG. 5 according toanother embodiment of the inventive concept.

DETAILED DESCRIPTION

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various embodiments of the invention. As used herein“embodiments” are non-limiting examples of devices or methods employingone or more of the inventive concepts disclosed herein. It is apparent,however, that various embodiments may be practiced without thesespecific details or with one or more equivalent arrangements. In otherinstances, well-known structures and devices are shown in block diagramform in order to avoid unnecessarily obscuring various embodiments.Further, various embodiments may be different, but do not have to beexclusive. For example, specific shapes, configurations, andcharacteristics of an embodiment may be used or implemented in anotherembodiment without departing from the inventive concepts.

Unless otherwise specified, the illustrated embodiments are to beunderstood as providing features of varying detail of some ways in whichthe inventive concept may be implemented in practice. Therefore, unlessotherwise specified, the features, components, modules, layers, films,panels, regions, and/or aspects, etc. (hereinafter individually orcollectively referred to as “elements”), of the various embodiments maybe otherwise combined, separated, interchanged, and/or rearrangedwithout departing from the inventive concept.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anembodiment may be implemented differently, a specific process order maybe performed differently from the described order. For example, twoconsecutively described processes may be performed substantially at thesame time or performed in an order opposite to the described order.Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, the D1-axis, the D2-axis,and the D3-axis are not limited to three axes of a rectangularcoordinate system, such as the x, y, and z-axes, and may be interpretedin broader sense. For example, the D1-axis, the D2-axis, and the D3-axismay be perpendicular to one another, or may represent differentdirections that are not perpendicular to one another. For the purposesof this disclosure, “at least one of X, Y, and Z” and “at least oneselected from the group consisting of X, Y, and Z” may be construed as Xonly, Y only, Z only, or any combination of two or more of X, Y, and Z,such as, for instance, XYZ, XYY, YZ, and ZZ. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various embodiments are described herein with reference to sectionaland/or exploded illustrations that are schematic illustrations ofidealized embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, embodiments disclosed herein should not necessarily beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. In this manner, regions illustrated in the drawings maybe schematic in nature and the shapes of these regions may not reflectactual shapes of regions of a device and, as such, are not necessarilyintended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

The meaning of “include” or “comprise” specifies a property, a fixednumber, a step, an operation, an element, a component or a combinationthereof, but does not exclude other properties, fixed numbers, steps,operations, elements, components or combinations thereof.

Hereinafter, exemplary embodiments of the inventive concept will bedescribed with reference to the accompanying drawings.

FIG. 1 is a perspective view of a display device according to anembodiment of the inventive concept. FIG. 2 is an exploded perspectiveview of the display device according to an embodiment of the inventiveconcept. FIG. 3 is a cross-sectional view of an electronic panelaccording to an embodiment of the inventive concept.

In this specification, a display device DD that is capable of beingapplied to a mobile terminal is exemplarily illustrated. Although notshown, electronic modules, a camera module, a power module, and thelike, which are mounted on a main board, may be disposed on abracket/case together with the display device DD to constitute themobile terminal. The display apparatus DD according to an embodiment ofthe inventive concept may be applied to large-sized electronicapparatuses such as televisions and monitors and small and middle-sizedelectronic apparatuses such as tablet PC, navigation units for vehicles,game consoles, and smart watches.

Referring to FIG. 1 , a display device DD may display an image IMthrough a display surface DD-IS. Icon images are illustrated as anexample of the image IM. The display surface DD-IS is parallel to asurface defined by a first direction DR1 and a second direction DR2. Anormal direction of the display surface DD-IS, i.e., a thicknessdirection of the display device DD is indicated as a third directionDR3. In this specification, “when viewed on a plane or on the plane” maymean a case when viewed in the third direction DR3. A front surface (ora top surface) and a rear surface (or a bottom surface) of each oflayers or units, which will be described below, are distinguished by thethird direction DR3. However, directions indicated as the first to thirddirections DR1, DR2, and DR3 may be changed into different directions,for example, opposite directions as a relative concept.

Also, the display surface DD-IS includes a display area DD-DA on whichan image IM is displayed and a non-display area DD-NDA that is adjacentto the display area DD-DA. The non-display area DD-NDA may be an area onwhich an image is not displayed. However, the inventive concept is notlimited thereto. The non-display area DD-NDA may be adjacent to one sideof the display area DD-DA or be omitted entirely.

Referring to FIG. 1 and FIG. 2 , the display device DD may include awindow WM, an electronic panel DM, a driving chip DC, a circuit boardPB, and an accommodation member BC. The accommodation member BC mayaccommodate the electronic panel DM and be coupled to the window WM.

The window WM may be disposed above the electronic panel DM to transmitan image provided from the electronic panel DM to the outside. Thewindow WM includes a transmission area TA and a non-transmission areaNTA. The transmission area TA may have a shape that overlaps the displayarea DD-DA to correspond to the display area DD-DA. The image IMdisplayed on the display area DD-DA of the display device DD may bevisible through the transmission area TA of the window WM from theoutside.

The non-transmission area NTA may have a shape that overlaps thenon-display area DD-NDA to correspond to the non-display area DD-NDA.The non-transmission area NTA may be an area having a lighttransmittance that is relatively less than that of the transmission areaTA. However, the inventive concept is not limited thereto, and thenon-transmission area NTA may be omitted.

The window WM may be made of glass, sapphire, or plastic. Also, althoughthe window WM is provided as a single layer, the window WM may include aplurality of layers. The window WM may include a base layer and at leastone printed layer overlapping the non-transmission area NTA and disposedon a rear surface of the base layer. The printed layer may have apredetermined color. For example, the printed layer may have a blackcolor or colors other than the black color.

The electronic panel DM is disposed between the window WM and theaccommodation member BC. The electronic panel DM includes a displaypanel DP and an input sensing layer ISU. The display panel DP generatesan image and transmits the generated image to the window WM.

According to an embodiment of the inventive concept, the display panelDP may be an emission type display panel, but the inventive concept isnot limited thereto. For example, the display panel DP may be an organiclight emitting display panel and a quantum-dot light emitting displaypanel. A light emitting layer of the organic light emitting displaypanel may include an organic light emitting material. A light emittinglayer of the quantum dot light emitting display panel may include aquantum dot, a quantum rod, and the like.

Hereinafter, the display panel DP of the inventive concept is describedas the organic light emitting display panel. However, the inventiveconcept is not limited thereto, and various display panels may beapplied to the present disclosure according to embodiments.

Referring to FIG. 3 , the display panel DP includes a base substrateSUB, a circuit element layer DP-CL disposed on the base substrate SUB, adisplay element layer DP-OLED, and an encapsulation layer TFL.

The electronic panel DM includes an active area DP-DA and a non-activearea DP-NDA. The active area DP-DA of the display panel DP maycorrespond to the display area DD-DA of FIG. 1 or the transmission areaTA of FIG. 2 , and the non-active area DP-NDA may correspond to thenon-display area DD-NDA of FIG. 1 or the non-transmission area NTA ofFIG. 2 .

The base substrate SUB may include at least one plastic film. The basesubstrate SUB may include a plastic substrate, a glass substrate, ametal substrate, or an organic/inorganic composite substrate as aflexible board.

The circuit element layer DP-CL includes at least one intermediateinsulation layer and a circuit element. The intermediate insulationlayer includes at least one intermediate inorganic film and at least oneintermediate organic film. The circuit element includes signal lines, adriving circuit of a pixel, and the like.

The display element layer DP-OLED may include a plurality of organiclight emitting diodes. The display element layer DP-OLED may furtherinclude an organic layer such as a pixel defining layer. According toanother embodiment, when the display panel is provided as a liquidcrystal display panel, the display element layer may be provided as aliquid crystal layer.

The insulation layer TFL seals the display element layer DP-OLED. Forexample, the insulation layer TFL may be a thin film encapsulationlayer. The insulation layer TFL protects the display element layerDP-OLED against foreign substances such as moisture, oxygen, and dustparticles. However, the inventive concept is not limited thereto. Forexample, an encapsulation substrate may be provided instead of theinsulation layer TFL. In this case, the encapsulation substrate may beopposite to the base substrate SUB, and the circuit element layer DP-CLand the display element layer DP-OLED may be disposed between theencapsulation substrate and the base substrate SUB.

The input sensing layer ISU may be disposed between the window WM andthe display panel DP. The input sensing layer ISU senses an inputapplied from the outside. The input applied from the outside may beprovided in various ways. For example, the external input includesvarious types of external inputs, such as a portion of user's body, astylus pen, light, heat, a pressure, or the like. Also, an input throughcontact with the portion of the human body such as user's hands as wellas adjacent or neighboring space touches (for example, hovering) mayalso be one form of the input.

The input sensing layer ISU may be directly disposed on the displaypanel DP. In this specification, that “a constituent A is directlydisposed on a constituent B” may mean that an adhesive member is notdisposed between the constituents A and B. In the present embodiment,the input sensing layer ISU may be manufactured together with thedisplay panel DP through a continuous process. However, the inventiveconcept is not limited thereto. For example, the input sensing layer ISUmay be provided as an individual panel and may then be coupled to thedisplay panel DP through an adhesive layer.

Referring again to FIG. 1 and FIG. 2 , the driving chip DC may overlapthe non-display area DP-NDA and be disposed on the display panel DP. Forexample, the driving chip DC may generate a driving signal that isrequired for the operation of the display panel DP on the basis of thecontrol signal transmitted from the circuit board PB. The driving chipDC may transmit the generated driving signal to the circuit elementlayer DP-CL of the display panel DP. In this specification, the drivingchip DC may be described as an electronic component.

The circuit board PB may be disposed on an end of the base substrate SUBand be electrically connected to the circuit element layer DP-CL. Thecircuit board PB may be rigid or flexible. For example, when the circuitboard PB is flexible, the circuit board PCB may be provided as aflexible printed circuit board. The circuit board PB may include atiming control circuit that controls an operation of the display panelDP. The timing control circuit may be mounted in the form of anintegrated chip on the circuit board PB. Also, the circuit board PB mayinclude an input sensing circuit that controls the input sensing layerISU.

FIG. 4 is a cross-sectional view of the input sensing layer according toan embodiment of the inventive concept.

Referring to FIG. 4 , the input sensing layer ISU includes a firstsensing insulation layer IS-IL1, a first conductive layer IS-CL1, asecond sensing insulation layer IS-IL2, a second conductive layerIS-CL2, and a third sensing insulation layer IS-IL3. The first sensinginsulation layer IS-IL1 may be directly disposed on the insulation layerTFL. However, the inventive concept is not limited thereto, and thus,the first sensing insulation layer IS-IL1 may be omitted. In this case,the first conductive layer IS-CL1 may be disposed directly on theinsulation layer TFL.

Each of the first conductive layer IS-CL1 and the second conductivelayer IS-CL2 may have a single-layer structure or a multi-layeredstructure in which a plurality of layers are stacked in the thirddirection DR3 (refer to FIG. 3 ). The conductive layer having amulti-layered structure may include at least two or more layers oftransparent conductive layers and metal layers. The conductive layerhaving the multi-layered structure may include metal layers includingmetals different from each other.

According to an embodiment of the inventive concept, the firstconductive layer IS-CL1 may include molybdenum, silver, titanium,copper, aluminum, and alloys thereof. For example, the first conductivelayer IS-CL1 may have a three-layered structure oftitanium/aluminum/titanium, which is a metal layer structure. Here, ametal having relatively high durability and low reflectivity may beapplied to an outer layer, and a metal having high electricalconductivity may be applied to an inner layer. The second conductivelayer IS-CL2 may be a transparent conductive layer such as indium tinoxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zincoxide (ITZO), PEDOT, metal nanowires, graphene, and the like.

However, the inventive concept is not limited thereto. For example, theconductive layers included in the first conductive layer IS-CL1 and thesecond conductive layer IS-CL2 may be variously modified. For example,the first conductive layer IS-CL1 may be a transparent conductive layer,and the second conductive layer IS-CL2 may be a metal layer.

Each of the first and second insulation layers IS-IL1 and IS-IL2 mayinclude an inorganic or organic layer. In this embodiment, the firstsensing insulation layer IS-IL1 may be an inorganic layer. However, theinventive concept is not limited thereto. For example, each of the firstsensing insulation layer IS-IL1 and the second sensing insulation layerIS-IL2 may be provided as the inorganic layer, and the third sensinginsulation layer IS-IL3 may be provided as the organic layer.

FIG. 5 is a plan view of the input sensing layer according to anembodiment of the inventive concept. FIG. 6 is a plan view of a sensinginsulation layer included in the input sensing layer according to anembodiment of the inventive concept.

Referring to FIG. 5 , the input sensing layer ISU includes a sensingarea AR and a peripheral area NAR adjacent to the sensing area AR. Thesensing area AR of the input sensing layer ISU may overlap the activearea DP-DA of the display panel DP described above. The non-active areaDP-NDA of the display panel DP may overlap the peripheral area NAR ofthe input sensing layer ISU. The sensing area AR may be an area on whichan input applied from the outside is sensed.

The input sensing layer ISU includes first sensing electrodes, secondsensing electrodes, first connection patterns BSP1, second connectionpatterns BSP2, a first line part IL-1, and a second line part IL-2. Thefirst sensing electrodes, the second sensing electrodes, the firstconnection patterns BSP1, and the second connection patterns BSP2overlap the sensing area AR, and the first line part IL-1 and the secondline part IL-2 overlap the peripheral area NAR.

The first sensing electrodes extend in the first direction DR1 and arearranged in the second direction DR2. Also, n first sensing electrodesmay be provided (where n is a natural number). Each of the first sensingelectrodes may include a plurality of first sensing patterns SP1 spacedapart from each other on the plane and arranged in the first directionDR1.

M second sensing electrodes may be provided (where m is a naturalnumber), which extend in the second direction DR2 and are arranged inthe first direction DR1. Each of the second sensing electrodes mayinclude a plurality of second sensing patterns SP2 spaced apart fromeach other on the plane and arranged in the second direction DR2. Thesecond sensing patterns SP2 may be spaced apart from and insulated fromthe first sensing patterns SP1 on the plane.

The first connection patterns BSP1 may electrically connect the firstsensing patterns SP1 to each other. For example, one first connectionpattern BSP1 may electrically connect two first sensing patterns SP1,which are adjacent to each other in the first direction DR1, of thefirst sensing patterns SP1 to each other.

The second connection patterns BSP2 may electrically connect the secondsensing patterns SP2 to each other. For example, one second connectionpattern BSP2 may electrically connect two second sensing patterns SP2,which are adjacent to each other in the second direction DR2, of thesecond sensing patterns SP2 to each other. The first connection patternBSP1 and the second connection pattern BSP2 may cross each other on theplane and be insulated from each other in a cross-section.

According to an embodiment of the inventive concept, the first sensingpatterns SP1, the second sensing patterns SP2, and the second connectionpatterns BSP2 may be formed through the same process and material andmay also be included in the second conductive layer IS-CL2 that isdescribed with reference to FIG. 4 . That is to say, the first sensingpatterns SP1, the second sensing patterns SP2, and the second connectionpatterns BSP2 may be directly disposed on the second sensing insulationlayer IS-IL2.

Particularly, each of the first sensing patterns SP1, the second sensingpatterns SP2, and the second connection patterns BSP2 may includetransparent conductive oxide. For example, the transparent conductiveoxide may include at least one of indium zinc oxide (IZO), indium tinoxide (ITO), indium gallium oxide (IGO), indium zinc gallium oxide(IGZO), or a mixture/compound thereof.

According to an embodiment of the inventive concept, the firstconnection patterns BSP1 may be included in the first conductive layerIS-CL1 described with reference to FIG. 4 . The first connectionpatterns BSP1 may be directly disposed on the first sensing insulationlayer IS-IL1. In this specification, the first sensing insulation layerIS-IL1 may be described as the base layer of the input sensing layer ISUdefining the sensing area AR and the peripheral area NAR. The firstconnection patterns BSP1 may be electrically connected to the firstsensing patterns SP1 through contact holes defined in the second sensinginsulation layer IS-IL2.

The first connection patterns BSP1 may include a material different fromthose of the components included in the second conductive layer IS-CL2.For example, the first connection patterns BSP1 may include a metalmaterial.

The first line part IL-1 includes first sensing lines SL1 electricallyconnected to one end and the other end of each of the first sensingelectrodes. The first sensing lines SL1 include first sub-lines SL1 a,second sub-lines SL1 b, and connection lines SL1 c. Each of the firstsub-lines SL1 a is connected to one end of each of the first sensingelectrodes, and each of the second sub-lines SL1 b is connected to theother end of each of the first sensing electrodes. The connection linesSL1 c are disposed between the first sub-lines SL1 a and the secondsub-lines SL1 b to electrically connect the first sub-lines SL1 a to thesecond sub-lines SL1 b.

Actually, the first sensing lines SL1 may be included in the firstconductive layer IS-CL1, and disposed on the first sensing insulationlayer IS-IL1 through the same process and the same material as the firstconnection patterns BSP1. That is, each of the first sub-lines SL1 a,the second sub-lines SL1 b and the connection lines SL1 c include ametal material may have one integrated shape formed on the first sensinginsulation layer IS-IL1.

The second sensing lines SL2 extend in the first direction DR1 and maybe disposed on a different layer from the first sensing lines SL1. Forexample, the second sensing lines SL2 may be disposed on the secondsensing insulation layer IS-IL2 overlapping the peripheral area NARthrough the same material and process as the sensing electrodes includedin the second conductive layer IS-CL2. The second sensing lines SL2 maybe electrically connected to the connection lines SL1 c of the firstsensing lines SL1 through contact holes defined in the second sensinginsulation layer IS-IL2 overlapping the peripheral area NAR.

In detail, referring to FIG. 6 , the second sensing insulation layerIS-IL2 includes a first insulation portion IS-IL2 a overlapping thesensing area AR and a second insulation portion IS-IL2 b overlapping theperipheral region NAR. The second insulation portion IS-IL2 b has asurface area less than that of the first insulation portion IS-IL2 a onthe plane and may be spaced apart from the first insulation portionIS-IL2 a.

The first insulation portion IS-IL2 a may overlap the first sensingelectrodes and the second sensing electrodes, which are included in thesecond conductive layer IS-CL2, and may be disposed on the firstconductive layer IS-CL1. A plurality of contact holes through which thefirst sensing electrodes and the first connection patterns BSP1 areelectrically connected to each other may be defined in the firstinsulation portion IS-IL2 a.

The second insulation portion IS-IL2 b may cover at least a portion ofeach of the first sensing lines SL1. For example, the second insulationportion IS-IL2 b may cover the connection lines SL1 c of the firstsensing lines SL1 and may be disposed on the first conductive layerIS-CL1. The second sensing lines SL2 may be disposed on the secondinsulation portion IS-IL2 b and may be electrically connected to theconnection lines SL1 c through the contact holes defined in the secondinsulation portion IS-IL2 b respectively.

Referring again to FIG. 5 , the second sensing lines SL2 may be bondedto an external circuit board to receive an electrical signal from theoutside. Each of the second sensing lines SL2 may include a first lineportion bonded to the external circuit board and a second line portionoverlapping the connection lines SL1 c of the first sensing lines SL1.The electrical signal received to the second sensing lines SL2 may betransmitted to the connection lines SL1 c through the contact holesdefined in the second insulation portion IS-IL2 b. As a result, theelectrical signals may be transmitted to one end and the other end ofeach of the first sensing electrodes through the first sub-lines SL1 aand the second sub-lines SL1 b which are adjacent to both ends of theconnection lines SL1 c.

The second line part IL-2 may include third sensing lines SL3respectively electrically connected to the second sensing electrodes.One end of each of the third sensing lines SL3 may be connected to eachof the second sensing electrodes, and the other end of each of the thirdsensing lines SL3 may receive an electrical signal required for drivingthe input sensing layer ISU from the outside. The other end of the thirdsensing lines SL3 may be aligned with ends of the connection lines SL1c. The third sensing lines SL3 may include a metal material and beformed through the same process as the first sensing lines SL1.

In addition, the second insulation portion IS-IL2 b illustrated in FIG.6 may cover a portion of each of the third sensing lines SL3. In thiscase, although not shown, signal lines electrically connected to thethird sensing lines SL3 and bonded to the external circuit board may bedisposed on the second insulation portion IS-IL2 b.

According to an embodiment of the inventive concept, each of the secondsub-lines SL1 b may partially overlap at least one or more secondsensing lines SL2 of the second sensing lines SL2. That is to say, onesecond sub-line SL1 b of the second sub-lines SL1 b may cross one secondsense line SL2 of the second sense lines SL2 on the plane.

The one second sub-line SL1 b and the one second sensing line SL2, whichcross each other on the plane may be insulated from each other throughthe second insulation portion IS-IL2 b. As a result, short circuitsbetween the one second sub-line SL1 b and the one of the second sensinglines SL2 may be prevented. This will be described in more detail withreference to FIG. 9 .

An electrical signal may be received from the outside through the secondsensing lines SL2 disposed on the second insulation portion IS-IL2 b.Also, external static electricity in addition to the electrical signalmay be received to the second sensing lines SL2. In this case, theexternal static electricity received to the second sensing lines SL2 maybe transmitted to the connection lines SL1 c through the contact holesdefined in the second insulation portion IS-IL2 b. As a result, theexternal static electricity may be transmitted to each of the firstsub-lines SL1 a and the second sub-lines SL1 b which are adjacent to theconnection lines SL1 c, and a damage to the sensing lines and thesensing electrodes connected thereto may occur.

According to an embodiment of the inventive concept, the connectionlines SL1 c electrically connected to the second sensing lines SL2disposed on the second insulation portion IS-IL2 b may have a meanderingshape on the plane. An intensity of external static electricity isinversely proportional to a length of the signal line. As a result, theconnection lines SL1 c according to the inventive concept may increasein length through a curved or zigzag shape as compared to a singlestraight shape on the same planer area. For example, each of theconnection lines SL1 c may have a zigzag shape that is bent at leasttwice or a curved shape that is bent at least twice. This will bedescribed in more detail with reference to FIG. 9 .

FIG. 7 is an enlarged view of an area AA of FIG. 5 according to anembodiment of the inventive concept. FIG. 8A is a cross-sectional viewtaken along line I-I′ of FIG. 7 . FIG. 8B is a cross-sectional viewtaken along line II-II′ of FIG. 7 .

Referring to FIG. 5 and FIG. 7 , two first sensing patterns SP1 facingeach other in the first direction DR1, two second sensing patterns SP2facing each other in the second direction DR2, the first connectionpattern BSP1, the second connection pattern BSP2, first auxiliarypattern BPL, and second auxiliary pattern BPR are exemplarilyillustrated.

The first and second auxiliary patterns BPL and BPR may be disposedbetween the two first sensing patterns SP1 and be spaced apart from thefirst sensing patterns SP1 on the plane. The first and second auxiliarypatterns BPL and BPR are spaced from each other.

According to the inventive concept, the first and second auxiliarypatterns BPL and BPR may be disposed on the same layer as the firstsensing patterns SP1 and the second sensing patterns SP2. For example,the first and second auxiliary patterns BPL and BPR may be disposed onthe second sensing insulation layer IS-IL2 through the same process andmaterial as the first sensing patterns SP1 and the second sensingpatterns SP2.

The first connection pattern BSP1 may electrically connect the two firstsensing patterns SP1 spaced apart from each other to each other by usingthe first and second auxiliary patterns BPL and BPR. Hereinafter, forconvenience of description, the first sensing pattern disposed on anupper side of the first connection pattern BSP1 is referred to as anupper first sensing pattern SP1, and the first sensing pattern disposedon a lower side is referred to as a lower first sensing pattern SP1. Thefirst connection pattern BSP1 includes a first branch part BSP1 a and asecond branch part BSP1 b which are at least partially overlapped thesecond connection pattern BSP2.

The first branch part BSP1 a includes a first sub-branch part BSL1 and asecond sub-branch part BSR1, which are spaced apart from each other. Thefirst sub-branch part BSL1 has one end and the other end, which areelectrically connected to the upper first sensing pattern SP1 and thefirst auxiliary pattern BPL through the contact holes defined in thesecond sensing insulation layer IS-IL2 (see FIG. 4 ), respectively. Thesecond sub-branch part BSR1 has one end and the other end, which areelectrically connected to the upper first sensing pattern SP1 and thesecond auxiliary pattern BPR through the contact holes defined in thesecond sensing insulation layer IS-IL2, respectively.

The second branch part BSP1 b includes a third sub-branch part BSL2 anda fourth sub-branch part BSR2, which are spaced apart from each other.The third sub-branch part BSL2 has one end and the other end, which areelectrically connected to the lower first sensing pattern SP1 and thefirst auxiliary pattern BPL through the contact holes defined in thesecond sensing insulation layer IS-IL2, respectively. The fourthsub-branch part BSR2 has one end and the other end, which areelectrically connected to the lower first sensing pattern SP1 and thesecond auxiliary pattern BPR through the contact holes defined in thesecond sensing insulation layer IS-IL2, respectively.

As described above, the first sub-branch part BSL1 electrically connectsthe first auxiliary pattern BPL to the upper first sensing pattern SP1,and the third sub-branch part BSL2 electrically connects the firstauxiliary pattern BPL to the lower first sensing pattern SP1. Similarly,the second sub-branch part BSL2 electrically connects the secondauxiliary pattern BPR to the upper first sensing pattern SP1, and thefourth sub-branch part BSR2 electrically connects the second auxiliarypattern BPR to the lower first sensing pattern SP1. As a result, theupper first sensing pattern SP1 and the lower first sensing pattern SP1may be electrically connected to each other.

According to an embodiment of the inventive concept, a dummy pattern DMPmay be disposed between the first sensing patterns SP1 and the secondsensing patterns SP2 on the plane. The dummy pattern DMP may be spacedapart from the first sensing patterns SP1 and the second sensingpatterns SP2. A spaced space OD is provided between the dummy patternDMP and the first sensing patterns SP1 and between the dummy pattern DMPand the second sensing patterns SP2. That is, the dummy pattern DMP maybe a floating pattern that is spaced apart from each of the firstsensing patterns SP1 and the second sensing patterns SP2. The dummypattern DMP may prevent gaps between the first sensing patterns SP1 andthe second sensing patterns SP2 from being visible.

Also, as illustrated in FIG. 7 , although each of the first sensingpatterns SP1, the second sensing patterns SP2, and the dummy pattern DMPis provided in a stair shape, the inventive concept is not limitedthereto. For example, each of the first sensing patterns SP1, the secondsensing patterns SP2, and the dummy pattern DMP may have a linear shapeor a groove shape. Since the dummy pattern DMP has the stair shape, asensing surface area for the external input may increase compared to thesame surface area. Thus, the input sensing unit having improved touchsensitivity may be provided.

Referring to FIG. 8A, a structure in which two first sensing patternsSP1 spaced apart from each other are electrically connected to eachother through the first sub-branch part BSL1 and the third sub-branchpart BSL2 is illustrated.

The second sensing insulation layer IS-IL2 covers the first sub-branchpart BSL1 and the third sub-branch part BSL2 and is disposed on thefirst sensing insulation layer IS-IL1. Also, the second sensinginsulation layer IS-IL2 defines a first contact hole CH-1, secondcontact holes CH-2 a and CH-2 b and a third contact hole CH-3.

The two first sensing patterns SP1, which are spaced apart from eachother, and the first auxiliary pattern BPL are disposed on the secondsensing insulation layer IS-IL2. Particularly, one of the two firstsensing patterns SP1 is electrically connected to the first sub-branchpart BSL1 through the first contact hole CH-1, and the other of the twofirst sensing patterns SP1 is electrically connected to the thirdsub-branch part BSL2 through the third contact hole CH-3. The firstauxiliary pattern BPL is electrically connected to the first sub-branchpart BSL1 and the third sub-branch part BSL2 through the second contactholes CH-2 a and CH-2 b.

The third sensing insulation layer IS-IL3 covers two first sensingpatterns SP1, which are spaced part from each other, and the firstauxiliary pattern BPL and is disposed on the second sensing insulationlayer IS-IL2.

Referring to FIG. 8B, the first auxiliary pattern BPL, the secondauxiliary pattern BPR, the second sensing patterns SP2, and the secondconnecting patterns BSP2 may be disposed on the second sensinginsulation layer IS-IL2 that is the same layer as the above-describedpatterns. According to the inventive concept, the first auxiliarypattern BPL and the second auxiliary pattern BPR may be spaced apartfrom the second sensing patterns SP2 and the second connection patternsBSP2 on the plane. That is, the first auxiliary pattern BPL and thesecond auxiliary pattern BPR may have a structure that is electricallyinsulated from the second sensing patterns SP2 and the second connectionpatterns BSP2.

FIG. 9 is an enlarged view of an area IDA of FIG. 5 according to anembodiment of the inventive concept. FIG. 10 is a plan view illustratingone connection line of connection lines of FIG. 9 according to anembodiment of the inventive concept. FIG. 11 is a cross-sectional viewtaken along line of FIG. 9 according to an embodiment of the inventiveconcept. FIG. 12 is a cross-sectional view taken along line IV-IV′ ofFIG. 9 according to an embodiment of the inventive concept.

Referring to FIG. 9 , four first sensing lines SL1-1, SL1-2, SL1-3, andSL1-4 of the first sensing lines SL1 illustrated in FIG. 5 and foursecond sensing lines SL2-1, SL2-2, SL2-3, and SL2-4 of the secondsensing lines SL2 are exemplarily illustrated. The first sensing linesSL1-1, SL1-2, SL1-3, and SL1-4 may be electrically connected to thesecond sensing lines SL2-1, SL2-2, SL2-3, and SL2-4, respectively.According to the inventive concept, the second sensing lines SL2 mayhave a planar area per unit length, which is greater than that of thefirst sensing lines SL1.

The first sensing line SL1-1 in a first column includes a first sub-lineSL1 a, a second sub-line SL1 b and a connection line SL1 c. The secondsensing line SL2-1 in the first column is disposed on a different layerfrom the first sensing line SL1-1 in the first column. The secondsensing line SL2-1 in the first column may be electrically connected tothe connection line SL1 c through the contact hole defined in the secondinsulation portion IS-IL2 b of the second insulation layer IS-IL2 (seeFIG. 6 ).

The first sensing line SL1-2 in a second column includes a firstsub-line SL2 a, a second sub-line SL2 b and a connection line SL2 c. Thesecond sensing line SL2-2 in the second column may be disposed on adifferent layer from the first sensing line SL1-2 in the second columnand be electrically connected to the connection line SL2 c through thecontact hole defined in the second insulation portion IS-IL2 b.

The first sensing line SL1-3 in a third column includes a first sub-lineSL3 a, a second sub-line SL3 b and a connection line SL3 c. The secondsensing line SL2-3 in the third column may be disposed on a differentlayer from the first sensing line SL1-3 in the third column and beelectrically connected to the connection line SL3 c through the contacthole defined in the second insulation portion IS-IL2 b.

The first sensing line SL1-4 in a fourth column includes a firstsub-line SL4 a, a second sub-line SL4 b and a connection line SL4 c. Thesecond sensing line SL2-4 in the fourth column may be disposed on adifferent layer from the first sensing line SL1-4 in the fourth columnand be electrically connected to the connection line SL4 c through thecontact hole defined in the second insulation portion IS-IL2 b.

Each of the first sub-lines SL1 a to SL4 a may be respectively connectedto one end of each of the first sensing electrodes and may have astructure in which the first sub-lines SL1 a to S14 a do not overlap thesecond sensing insulation layer IS-IL2. However, the inventive conceptis not limited thereto, and at least a portion of each of the firstsub-lines SL1 a to SL4 a may overlap the second insulation portionIS-IL2 b. For example, one end of each of the first sub-lines SL1 a toSL4 a may overlap the second insulation portion IS-IL2 b and the otherend of each of the first sub-lines SL1 a to SL4 a may overlap the firstinsulation portion IS-IL2 a so as to be connected to one end of each ofthe first sensing electrodes. One end and the other end of each of thefirst sub-lines SL1 a to SL4 a may not overlap the second sensinginsulation layer IS-IL2 therebetween.

The second sub-lines SL1 b to SL4 b may be connected to the other endsof the first sensing electrodes, respectively. Particularly, accordingto the inventive concept, one of the second sub-lines SL1 b to SL4 b mayoverlap at least one of the second sensing lines SL2-1 to SL2-4. Forexample, the second sub-line SL1 b in the first column, which isillustrated in FIG. 9 , may extend in the second direction DR2 to crossthe second sensing lines SL2-1 to SL2-4 extending in a first directionDR1 on the plane. For another example, the second sub-line SL2 b in thesecond column may extend in the second direction DR2 to cross the secondsensing lines SL2-2 to SL2-4 extending in the first direction DR1 on theplane.

In this case, the second sub-line SL1 b in the first column may beinsulated from the second sensing lines SL2-1 to SL2-4 through thesecond insulation portion IS-IL2 b. The second sub-line SL2 b in thesecond column may be insulated from the second sensing lines SL2-2 toSL2-4 through the second insulation portion IS-IL2 b.

According to an embodiment of the inventive concept, each of theconnection lines SL1 c to SL4 c in the first to fourth columns may havethe meandering shape. This is done because the connection line havingthe meandering shape has a length greater than that of the connectionline having the single straight shape under the same surface area.Particularly, the connection lines SL1 c to SL4 c in the first-to-fourthcolumns may be connected to the second lines SL2-1 to SL2-4 through thecontact hole CNT defined in the second insulation portion IS-IL2 brespectively.

Also, the connection lines SL1 c to SL4 c may be entirely covered by thesecond insulation portion IS-IL2 b. The second sensing lines SL2-1 toSL2-4 may be disposed on the second insulation portion IS-IL2 b and maybe respectively connected to the connection lines SL1 c to SL4 c throughthe contact holes CNT.

Each of the second sensing lines SL2-1 to SL2-4 has a shape extending inthe first direction DR1, and the second sensing lines SL2-1 to SL2-4 mayhave substantially the same surface area on the plane. That is, thesecond sensing lines SL2-1 to SL2-4 may have the same length in thefirst direction DR1. In this specification, substantially the samesurface area and the same length may be described as including a processerror.

According to the inventive concept, the contact holes CNT defined in thesecond insulation portion IS-IL2 b may be defined in the same line inthe second direction DR2. Particularly, each of the connection lines SL1c to SL4 c may be disposed between the corresponding one contact holeCNT of the contact holes CNT and the corresponding second sub-line ofthe second sub-lines SL1 b to SL4 b. In the plane, the one contact holeCNT may be defined in the second insulation portion IS-IL2 b adjacent toan end of the corresponding second sensing line of the second sensinglines SL2-1 to SL2-4.

In addition, as described above, each of the second sensing lines SL2-1to SL2-4 includes a first line portion PA1 bonded to the externalcircuit board and a second line portion PA2 overlapping thecorresponding connection line of the connection lines SL1 c to SL4 c. Inthis case, the ends of the second sensing lines SL2-1 to SL2-4 may bedefined as an end of the second line portion PA2 that is most spacedapart from the first line portion PA1 in the first direction DR1.

For example, the connection line SL1 c in the first column may bedisposed between the contact hole CNT in the first column and the secondsub-line SL1 b in the first column and have a first length. Theconnection line SL2 c in the second column may be disposed between thecontact hole CNT in the second column and the second sub-line SL1 b inthe second column and have a second length less than the first length.The reason in which the second length is less than the first length isthat the distance between the second sub-line SL2 b and the contact holeCNT in the second column is smaller than the distance between the secondsub-line SL1 b and the contact hole CNT in the first column

As described above, external static electricity may be transmitted tothe connection lines SL1 c to SL4 c in the first to fourth columnsthrough the contact hole CNT. According to the inventive concept, sinceeach of the connection lines SL1 c to SL4 c in the first to fourthcolumns has the meandering shape, a time taken to transmit the externalstatic electricity to the first sub-lines SL1 a to SL4 a and the secondsub-lines SL1 b to SL4 b may increase. As a result, an intensity of theexternal static electricity may also be weakened.

In detail, according to an embodiment illustrated in FIG. 10A, althoughone connection line SL1 c of the connection lines SL1 c to SL4 c isexemplarily illustrated, the other connection lines SL2 c to SL4 c mayalso have the same structure.

The connection line SL1 c includes a pattern PN that is bent at leasttwice. For example, the pattern PN includes a first portion P1, a secondportion P2, and a third portion P3. The first portion P1 extends in thesecond direction DR2. The second portion P2 may extend in the seconddirection DR2 to face the first portion P1 in the first direction DR1.The third part P3 may extend in the first direction DR1 to connect thefirst part P1 to the second part P2. That is, the third portion P3 maybe bent at one end of the first portion P1, and the second portion P2may be bent at one end of the third portion P3.

According to an embodiment, the connection line SL1 c may include atleast one pattern PN. That is, the connection line SL1 c may include aplurality of patterns PN connected to each other.

According to an embodiment illustrated in FIG. 9 and FIG. 10B, at leasta portion of the connection line SL1 c-1 may have a curved shape. Oneend and the other end of the curved connection line SL1 c-1 may beconnected to the first sub-line SL1 a and the second sub-line SL1 b.

Referring to FIG. 11 , the connection line SL3 c is disposed on thefirst sensing insulation layer IS-IL1. The second insulation portionIS-IL2 b of the second sensing insulation layer IS-IL2 may cover theconnection line SL3 c and be disposed on the first sensing insulationlayer IS-IL1. The second sensing line SL2-3 may be electricallyconnected to the connection line SL3 c through a plurality of contactholes CNT defined in the second insulation portion IS-IL2 b.

Referring to FIG. 12 , the second sub-lines SL1 b to SL4 b extending inthe second direction DR2 may be disposed on the first sensing insulationlayer IS-IL1. The second insulation portion IS-IL2 b of the secondsensing insulation layer IS-IL2 covers the second sub-lines SL1 b to SL4b and is disposed on the first sensing insulation layer IS-IL1. In thiscase, the second sensing line SL2-4 in the fourth column may have astructure overlapping each of the second sub-lines SL1 b to SL4 b.Particularly, the second sensing line SL2-4 in the fourth column maycross the second sub-lines SL1 b to SL4 b on the plane.

FIG. 13 is an enlarged view of an area IDA of FIG. 5 according toanother embodiment of the inventive concept.

Referring to FIG. 13 , at least two second sensing lines of secondsensing lines SL2-1 to SL2-4 may have different surface areas on aplane. For example, the second sensing line SL2-1 in a first column mayhave a surface area less than that of the second sensing line SL2-2 inthe second column on the plane. Also, contact holes CNT in the firstcolumn and contact holes CNT in a second column, which are defined in asecond insulation portion IS-IL2 b may be located on different lines inthe second direction DR2.

That is, according to the inventive concept, the contact hole CNT in thefirst column and the second sub-line SL1 b in the first column may beprovided to be maximally spaced apart from each other in the firstdirection DR1. As a result, a length of a connection line SL1 c, whichis disposed between the contact hole CNT in the first column and thesecond sub-line SL1 b in the first column and has the meandering shape,may be set to be maximized.

Similarly, the contact hole CNT in the second column and the secondsub-line SL1 b in the second column may be provided to be maximallyspaced apart from each other in the first direction DR1. As a result, alength of a connection line SL2 c, which is disposed between the contacthole CNT in the second column and the second sub-line SL2 b in thesecond column and has the meandering shape, may be set to be maximized.

FIG. 14 is an enlarged view of an area IDA of FIG. 5 according toanother embodiment of the inventive concept.

Referring to FIG. 14 , a portion of each of first sub-lines SL1 a to SL4a may have the meandering shape. For example, each of the firstsub-lines SL1 a to SL4 a illustrated in FIG. 14 may include at least onepattern PN illustrated in FIG. 10A. As a result, the patterns betweenthe first sub-lines SL1 a to SL4 a and the connection lines SL1 c to SL4c may be substantially similar to each other to improve externalvisibility.

Also, in this case, the second sensing lines SL2-1 to SL2-4 may have thesame planer area, or at least two or more second sensing lines may havedifferent planar areas.

Although certain embodiments have been described herein, otherembodiments and modifications will be apparent from this description.Accordingly, the inventive concepts are not limited to such embodiments,but rather to the broader scope of the appended claims and variousobvious modifications and equivalent arrangements as would be apparentto a person of ordinary skill in the art.

What is claimed is:
 1. A display device comprising: a display panel; andan input sensing layer disposed on the display panel and including asensing area and a peripheral area adjacent to the sensing area,wherein: the input sensing layer comprises: a first insulation layerdisposed on the display panel; first lines overlapping the peripheralarea and disposed on the first insulation layer, the first linescomprising: connection lines; first sub-lines, each of which is adjacentto one end of each of the connection lines; and second sub-linesadjacent to the other end of each of the connection lines; a secondinsulation layer comprising a first insulation portion overlapping thesensing area and a second insulation portion overlapping the peripheralarea and configured to cover a portion of each of the connection lines;sensing electrodes overlapping the sensing area and disposed on thefirst insulation portion, each sensing electrode comprising one endconnected to each of the first sub-lines and the other end connected toeach of the second sub-lines; and second lines disposed on the secondinsulation portion, the second lines being electrically connected to theconnection lines through contact holes defined in the second insulationportion, respectively; and at least a portion of each of the connectionlines has a meandering shape.
 2. The display device of claim 1, furthercomprising a circuit board configured to provide a sensing signal to theinput sensing layer, wherein: each of the second lines comprises a firstline portion bonded to the circuit board and a second line portion thatoverlaps the at least a portion of each of the first lines; and the atleast a portion of each of the connection lines is disposed between thecontact holes and the first line portion.
 3. The display device of claim1, wherein: the first sub-lines, the second sub-lines, and theconnection lines are disposed on the first insulation layer through thesame process; and each of the second lines has a planar area per unitlength greater than that of each of the first lines.
 4. The displaydevice of claim 1, wherein one second line of the second lines crossesat least one or more first lines of the first lines on a plane.